New Nanocomposite Films Boost Heat Dissipation in Thin Electronics

In a new study, scientists from Japan designed flexible thermal diffusion films made of cellulose nanofiber matrix and carbon-fiber filler using liquid-phase three-dimensional patterning. The prepared films showed large thermal conductivity anisotropy in the in-plane direction, boosting heat dissipation and avoiding thermal interference between heat sources toward thin film electronic devices.
  1. Department of Industrial Chemistry, Faculty of Engineering, Tokyo University of Science
  2. Graduate School of Engineering, Osaka University
  3. Department of Media Engineering, Graduate School of Engineering, Tokyo Polytechnic University
  4. Department of Electrical and Electronic Engineering, National Institute of Technology, Oita College

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Tokyo University of Science

Tokyo University of Science

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Tokyo University of Science (TUS) is one of the most well-known, respected, and the largest science-specialized private research universities in Japan.